During the chip manufacturing process, there are four major contamination problems on the chip surface: particles, organic residues, inorganic residues, and oxide layers that need to be removed。If the accuracy of cleaning is not enough, the residual impurities will lead to the electrical failure of the chip, in the production of the chip, 80% of the electrical failure is caused by the defect caused by contamination, so the semiconductor cleaning process is crucial to the yield of the chip, but also the basis of the cleaning equipment enterprises, where the competitive advantage。

Because the cleaning process not only removes the photoresist from the wafer surface, but also removes complex etching residues, metal debris particles, and other contaminants, newer, finer and even more environmentally friendly cleaning methods are needed。

DSJet uses dry ice particles to break impurities such as burrs and particles on the surface of semiconductor chips, so that the semiconductor surface can meet the requirements of high cleanliness。It solves the problem that the surface particles and surface contaminants of semiconductor power chips are not cleaned thoroughly, which will cause voltage breakdown or tip discharge during high voltage test。